Ufs 3.1 Pinout Link
One of the greatest frustrations is that vendors (Samsung, Kioxia, Western Digital) rarely publish public datasheets for UFS 3.1 pinouts. You will encounter:
*Pro Tip: * Use open-source hardware databases (e.g., from Pine64 or Raspberry Pi CM4 carrier boards) or schematics of older flagship phones (Google Pixel 6, OnePlus 9) which often leak detailed UFS pinouts.
Decoupling Capacitors: Place 0.1µF and 4.7µF ceramic capacitors as close as possible to each VCC and VCCQ ball group. Insufficient decoupling causes signal integrity loss on the M-PHY lines.
| Symptom | Pin to Check | Volt/Action | | :--- | :--- | :--- | | Device not detected in BIOS/OS | VCC | Measure at ball (not periphery). Low voltage <2.5V. | | Intermittent read errors | DOUT_T0_P/M | Check AC coupling caps (100nF). Open or shorted cap kills signal. | | High power consumption | VCCQ | RST_N floating high? Pull it actively. | | Failed DFU (Device Firmware Update) | REF_CLK_P/N | High jitter or wrong frequency. Host PLL issue. |
Subject: [Request] UFS 3.1 Standard Pinout Schematic
Body: Hi everyone,
I'm currently working on a trace repair for a mainboard with a UFS 3.1 storage chip. The pads are damaged, and I'm having trouble identifying the specific TX/RX differential pairs under the microscope.
Does anyone have a generic BGA-153 pinout diagram for UFS 3.1 they could share? Specifically looking to confirm the location of the REF_CLK and Ground pads to map the rest of the circuit. ufs 3.1 pinout
Image of the damaged area attached below. 👇
Thanks in advance!
#MobileRepair #Schematics #UFS #HelpNeeded
standard (JESD220E) typically uses a 153-ball BGA (Ball Grid Array) package, similar to previous UFS generations like 2.1 and 3.0, but with updated electrical specifications for higher speeds. Key Signals and Power Rails
UFS 3.1 utilizes a differential serial interface (M-PHY) with up to two lanes for data transfer. Mouser Electronics Data Lanes (Differential Pairs): DIN_t / DIN_c: Input data lanes (Host to Device). DOUT_t / DOUT_c: Output data lanes (Device to Host). Power Supplies: VCC (2.7V – 3.6V): Main power for the NAND flash media. VCCQ (1.14V – 1.26V): Power for the UFS controller and I/O interface. VCCQ2 (1.7V – 1.95V):
Typically used for the M-PHY layer or other low-voltage internal modules. Control Signals:
Reference clock input (square wave, single-ended), critical for High-Speed (HS) modes. Hardware reset signal (active low). Mouser Electronics Pin Assignment Groups (153-Ball BGA) One of the greatest frustrations is that vendors
While the full 153-ball map contains many ground (GND) and "No Connect" (NC) pins, the critical functional pins are clustered as follows: Core Voltage
Typically multiple pins (e.g., A3, B3, C3) for current capacity. I/O Voltage Low voltage rail (1.2V typical). PHY Voltage Mid-range voltage rail (1.8V typical). Transmit Pairs
Differential output signals from host view (DIN for device). Receive Pairs
Differential input signals from host view (DOUT for device). Reference Clock Necessary for HS-G3 and HS-G4 modes. System reset pin. In-System Programming (ISP) Points
For data recovery or forensic tasks, "ISP" refers to soldering directly to specific test points on a PCB rather than the full BGA grid. Common ISP connections for UFS 3.1 include: VCC & VCCQ TX0_P/N & RX0_P/N (Data Lane 0) Some UFS 3.1 implementations require a 10-ohm resistor
on the TX line to ground to enable communication with certain flasher boxes. ball-by-ball map
for a specific package size, such as the 11.5mm x 13mm variant? * Pro Tip: * Use open-source hardware databases (e
JEDEC Publishes Update to Universal Flash Storage (UFS) Standard 30 Jan 2020 —
UFS 3.1 introduces new features intended to help maximize device performance while minimizing power usage. 153-Ball Automotive UFS Memory - Mouser Electronics
Universal flash storage (UFS) controller and NAND. Differential I/O pins. – 2 lanes supported. – High speed: Gear 1/2/3 supported. Mouser Electronics
UFS 3.1协议分析(第六章) -- UFS电气信号 - CSDN博客 22 Sept 2021 —
UFS信号 UFS供电 复位 参考时钟. UFS有三个供电电压,分别是VCC、VCCQ、VCCQ2。 ufs3.1中规定的电压值范围为: VCC从300mV上升到2.4V / 2.7V时间为35ms. CSDN博客 UNIVERSAL FLASH STORAGE (UFS 3.1)
* Deep Sleep(mA) VCCQ(1.2V) VCC(2.5V) VCCQ(1.2V) 537. 124. 439. 0.36. 0.05. 0.15. 0.06. „Mouser Electronics“ Lietuva Samsung UFS Card 7 Apr 2016 —
⚠️ Important Note: UFS 3.1 uses M-PHY 4.1 (Gear 4) and UniPro 1.8. While the pinout is physically compatible with UFS 2.x, high-speed signals (Rx/Tx) require stricter PCB layout. Always verify with the specific component datasheet (e.g., Samsung, Kioxia, Micron, SK Hynix).
This guide summarizes the common UFS (Universal Flash Storage) 3.1 BGA/module pinout conventions and signal descriptions for system designers. Assume typical mobile-device connector or BGA module mapping; exact pin names and positions depend on vendor/module footprint — always consult the module/datasheet for final layout and electrical details.